Intel’s Raja Koduri gave the Monday keynote talk at the Hotchips 32 conference today. He argued in the keynote that within the next 5 years the industry would be able to increase performance by 1000 times.
Sander Olson attended this presentation.
Raja describes a path to 50x Transistor Density.
Pitch scaling will triple the density of Finfets.
Nanowires will provide another doubling over Pitch scaling.
Stacked nanowires will double the density over nanowires
Stacked wafers will provide another doubling.
Die wafer stacking provides another doubling.
Memory and Packaging Breakthroughs
SOURCES- Hot Chips, Intel, Sander Olson Written By Brian Wang, Nextbigfuture.com
Brian Wang is a Futurist Thought Leader and a popular Science blogger with 1 million readers per month. His blog Nextbigfuture.com is ranked #1 Science News Blog. It covers many disruptive technology and trends including Space, Robotics, Artificial Intelligence, Medicine, Anti-aging Biotechnology, and Nanotechnology.
Known for identifying cutting edge technologies, he is currently a Co-Founder of a startup and fundraiser for high potential early-stage companies. He is the Head of Research for Allocations for deep technology investments and an Angel Investor at Space Angels.
A frequent speaker at corporations, he has been a TEDx speaker, a Singularity University speaker and guest at numerous interviews for radio and podcasts. He is open to public speaking and advising engagements.
